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 55 Commerce Way
Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com
GHB-1104R-Y
Features
! 3.0mmx1.0mm SMT ! LOW ! WIDE ! IDEAL
Description
LED, 2.0mm THICKNESS. The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode.
POWER CONSUMPTION. VIEWING ANGLE. FOR BACK LIGHT AND INDICATOR. COLORS AND LENS TYPES AVAILABLE. 2000PCS / REEL.
3.0x1.0 mm SMD CHIP LED LAMP
! VARIOUS
! PACKAGE :
Package Dimensions
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.15(0.006") unless otherwise noted. 3. Specifications are subject to change without notice.
REV NO: V.2
DATE:DEC/12/2002
PAGE: 1 OF 4
Selection Guide
Par t No.. Pa No art No. Dice ic Lens Typ L ens Ty p e ens Typ s Ty d Iv (mcd) Iv (m c d ) (mcd @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 60 120 Viewing Viewin g View in i Angle
GHB-1104R-Y
S UPER BRIGHT YELLOW (InGaAlP)
WATER CLEAR
36
Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P a r a m e t er Pa aramete Peak Wavelength D ominate Wavelength Spectral Line Half-width C apacitance Forward Voltage Reverse Current D ev i c e evic e Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p.. Ty p yp 590 588 28 25 2.0 2.5 10 Max .. ax x Un its nit nm nm nm pF V uA Tes t Co n d it io ns Test Cond ition s est s IF=20mA IF=20mA IF=20mA V F =0V;f=1MHz IF=20mA VR = 5V
Absolute Maximum Ratings at TA=25 C
P ar a m e t er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature
Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Su p er B r ig h t Yello w Su uper Br ht Ye Brig Yellow Brigh Yello B Y 125 30 150 5 -40 C To +85 C
Un its Unit nit mW mA mA V
REV NO: V.2
DATE:DEC/12/2002
PAGE: 2 OF 4
REV NO: V.2
DATE:DEC/12/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
Recommended Soldering Pattern (Units : mm)
Tape Specifications (Units : mm)
REV NO: V.2
DATE:DEC/12/2002
PAGE: 4 OF 4


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